CHIPBOARD NON-ENCAPSULATED PANEL
Unitile Chip Board (Non-Encapsulated) panels constructed around a high density E1 grade chipboard core. The system fully complies with the Euro Class requirement of EN 12825. The base and the top surface of the core is factory bonded using an appropriate combination of surface finishes such as Aluminum, Galvanized Iron sheet, High Pressure Laminate etc.
DIMENSIONS: 600 mm x 600 mm | 600 mm x 800 mm
PANEL THICKNESS: 35 mm | 38 mm
TOP: Galvanized Iron Sheet / HPL / PVC
BOTTOM: Galvanizes Iron Sheet / Aluminium foil
CORE: High density E1-grade chipboard
APPLICATION: Open office, Data center, Control room, Casino, Co-working, Education
features
High strength to weight performance
Unique inbuilt stringer design
Environment-friendly core system
Precise floor levelling and positive alignment
Enhanced electrical continuity
Good acoustical property
system selection guide
- Deflection
- 2.5 mm
- 3.0 mm
- 4.0 mm
- 35 mm
- Concentrated Load kgs (KN)
- 530 / 5.19
- 600 / 5.88
- 740 / 7.25
- 38 mm
- Concentrated Load kgs (KN)
- 660 / 6.47
- 690 / 6.76
- 840 / 8.23
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Edge Rigid Grid System
Edge support under-structure provides maximum floor stability. It reduces all lateral movements and also ensures integrity of the floor on removal of panels for access to services in the sub-floor. Stringers are mechanically fastened to the pedestal head and panels are then placed on the grid formed. This system is ideal for high finished floor heights.
- FINISHED FLOOR HEIGHT:
- Minimum: 150 mm
Maximum: 2000 mm
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Drawings
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certificates
types of understructure support system
applications
Open Office
Data Center
Control Room
Casino
Co-Working
